Volume 4, Issue 1, June 2019, Page: 54-61
Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process
Chironjeet Chaki, Department of Mechanical Engineering, Rajshahi University of Engineering & Technology, Rajshahi, Bangladesh
Manoshi Chaki, Department of Apparel Engineering, Bangladesh University of Textiles, Dhaka, Bangladesh
Keya Roy, Department of Civil Engineering, Rajshahi University of Engineering & Technology, Rajshahi, Bangladesh
Received: May 30, 2019;       Accepted: Jul. 2, 2019;       Published: Jul. 15, 2019
DOI: 10.11648/j.ajmsp.20190401.17      View  44      Downloads  7
Abstract
A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application’s solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application ‘Matlab’. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.
Keywords
Diffusion Soldering, Finite Element Model, Power Electronic Application, Interconnection Technology
To cite this article
Chironjeet Chaki, Manoshi Chaki, Keya Roy, Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process, American Journal of Materials Synthesis and Processing. Vol. 4, No. 1, 2019, pp. 54-61. doi: 10.11648/j.ajmsp.20190401.17
Copyright
Copyright © 2019 Authors retain the copyright of this article.
This article is an open access article distributed under the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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